Printed-wiring board
作者： Shigeki Sawa , Naoaki Fujii , Katsuhiko Tanno , Hironori Tanaka , Yoichiro Kawamura
DOI:
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摘要: A printed wiring board including a substrate provided with at least one conductor circuit, solder resist layer on the surface of substrate, pad formed from part circuit exposed an opening in layer, and bump for mounting electronic parts pad. In board, since is aligned pitch about 200 μm or less, ratio (W/D) diameter W to D 1.05 1.7, connection reliability insulation can be easily improved.
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