作者: S. Daniel Cromwell
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摘要: A package for heat sinks and semiconductor components that adequately dissipates from without damaging or bending the component electrical grid terminals imposing mechanical stress on component. The includes both sink situated in one unit minimizes thermal path. may be packaged a field replaceable (FRU) act as handle use its own replacement. FRU contains unit, thereby enables safe, simplified, cost effective maintenance, including removal addition of components, outside manufacturing environment. further docking assembly mounted printed circuit board orients positions to align insertion board.