A pressure sensor using flip-chip on low-cost flexible substrate
作者： Guo-Wei Xiao , P.C.H. Chan , A. Teng , Jian Cai , M.M.F. Yuen
关键词:
摘要: The packaging of microelectromechanical systems (MEMS) is complex and it essential to the successful commercialization many MEMS devices. In this paper, a pressure sensor an actuator were assembled on flexible substrate using FCOF technology. A photolithography process was developed meet solder bump fabrication requirement chip. Eutectic bumps (63Sn/37Pb) with 250 /spl mu/m pitch fabricated electroplating process. flip-chip designed for package. electrical test results package satisfied requirements samples evaluated inspected various techniques, such as scanning acoustic microscope (SAM), X-ray imaging, electron microscopy (SEM), etc. flatness underfill reliability Most shear failure located at interface between mask after assembly.
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