作者: Jianjun Tian , Farong Huang , Lei Du , Jianxiang Huang , Liqiang Wan
DOI: 10.1002/APP.30433
关键词:
摘要: 4,4′-Diazidomethylbiphenyl (DAMBP) and poly(dimethylsilylene-ethynylenephenyleneethynylene) (PDMSEPE) were thermally polymerized to form a novel silicon-containing polytriazole resin (PDMSEPE-DAMBP) by 1,3-dipolar cycloaddition. Differential scanning calorimetry, FTIR, 13C-NMR used characterize the curing behaviors of PDMSEPE-DAMBP resins. The results indicated that resins could cure at temperatures as low 80°C. Dynamic mechanical analysis showed there was glass transition 302°C for cured resin. carbon fiber (T700) reinforced composites exhibited excellent properties room temperature high property retention 250°C. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci,