The Nucleation of Sn in Undercooled Melts: The Effect of Metal Impurities
作者： Gregory Parks , Austin Faucett , Craig Fox , Jake Smith , Eric Cotts
DOI: 10.1007/S11837-014-1161-2
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摘要: The dependence of the solidification temperature on concentration x impurity atoms, M, Sn-M alloys after cooling from melt was measured separately for M = Co, Ni, Ag, and Cu. For a comparison, similar measurements were performed SAC305-Ni alloys. Large variations in undercooling observed. It found that Ag atoms dissolved Sn-Ag significantly lowered undercooling, although presence Ag3Sn intermetallic compounds did not. While Cu6Sn5 Sn-Cu melts not lower contact with Cu interface reduced. addition Ni to Pb-free solder SAC305 caused factor two reduction observed high-purity Sn.
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