Transistors and method for making ohmic contact to transistors

作者: Sten Heikman , Primit Parikh

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摘要: A transistor device having non-alloyed ohmic contacts formed by a process that improves the contact morphology and reduces metal spiking into semiconductor layers. During fabrication, regrowth mask is deposited on device. portion of epitaxial layers removed, defining areas for selective highly-doped material. The remaining forms residual layer. After regrowth, are structures without use high-temperature annealing process. layer does not need to be but rather remains throughout fabrication can function as passivation and/or spacer

参考文章(100)
Christopher A. Bozada, Gregory C. DeSalvo, Tony K. Quach, Carl I. Pettiford, Charles K. Havasy, James K. Gillespie, Kenichi Nakano, G. David Via, John L. Ebel, James S. Sewell, Ross W. Dettmer, Charles L.A. Cerny, Thomas J. Jenkins, Digital wet etching of semiconductor materials ,(1997)
Aina Olaleye, Ayub Fathimulla, MODFET structure for threshold control ,(1991)
Daniel Pinkham, Gary Groner, Gerard Joseph Demott, Method and system for preheating glass batch or ingredient(s) ,(2007)
Ivan Milosavljevic, Lorna Hodgson, Adele Schmitz, Ming Hu, Michael Antcliffe, Passivated tiered gate structure transistor and fabrication method ,(2006)
David B. Slater, John Edmond, Michael John Bergmann, David Todd Emerson, Kevin Haberern, Matthew Donofrio, Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures ,(2008)
Stephen T. Chambers, Stephen T. Luce, Dual glass contact process ,(1987)
Masayuki Sonobe, Toshio Nishida, Yukio Shakuda, Semiconductor Light Emitting Device ,(2005)
Gerard Harbers, Oleg Borisovich Shchekin, Mark Pugh, Michael R. Krames, John E. Epler, Low profile side emitting LED ,(2007)