Bond preparation in electrical deflection-sensitive transducer

摘要: A method of preparing in an electrical deflection-sensitive transducer a bond between piezoresistive element and carrier therefor. The includes the flowing mass gold-tin alloy (about 80 percent gold about 20 tin, by weight) into intimate contact with carrier, solidifying flowed deposit joining two, subsequent alternate heating (without liquefying) chilling to relieve stresses therein.