Optimised curing of silver ink jet based printed traces

摘要: Manufacturing electronic devices by printing techniques with low temperature sintering of nano-size material particles can revolutionize the electronics industry in coming years. The impact this change to be significant enabling low-cost products and flexibility manufacturing. implementation a new production technology materials requires thorough elementary knowledge creation. It should noticed that although some first ideally manufactured printing, at present several modules are fact using hybrid (for instance photolithography, vapor depositions, spraying, etc...). However, future advances may enable major part interconnections. main challenge such opportunity is provide sufficient quality interconnecting traces appropriate manipulation sintering, more precisely deposition, process control electric conductivity printed In paper optimal curing conditions Ag-nano ink deposited ink-jet technique elaborated. To achieve good product quality, minimal stresses adequate energy deposition metallic nano particles) have understood optimized. other words combined way minimized whole assembly manufacturing process. Theoretically stress obtained if localized (only nano-ink traces) used. heating challenging requirement for mass applications (slow volume process). More solutions take advantage volumetric optimized thermal management entire assembly. constellation heat propagation has well work we investigated effects on micro structure electrical cured traces. Experimental involved set test vehicles resistance measurements variation depositions. A traces, different length thickness were exposed conditions. Quality sintered was examined structural, numerical methods. By drawing correlations between relevant parameters profile Agnano found. Thermo mechanical modeling simulations analysis performed ANSYS software.