Recent developments in high integration multi-standard CMOS transceivers for personal communication systems

作者: Jacques C. Rudell , Danelle Au , Troy Robinson , Danilo Gerna , Masanori Otsuka

DOI: 10.1145/280756.280868

关键词:

摘要: Issues associated with the integration of transceiver components on to a single silicon substrate are discussed. In particular, recently proposed receiver and transmitter architectures for high examined promise providing multistandard capability. addition, existing barriers lower power operation as well some directions future integrated research development.

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