Wafer scale thermoelectric energy harvester having interleaved, opposing thermoelectric legs and manufacturing techniques therefor

摘要: An integrated circuit may include a substrate and dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements n-type be disposed within that are connected in series while alternating between elements. The first second substrates each having thereon legs respective type material. also have conductors, coupled to base an associated leg forming mounting pad for coupling counterpart In other embodiments, one or more trenches therein capture eutectic material facilitates bonds components from prevent inadvertent short circuits occur system.