Method for treating laser-structured plastic surfaces
作者： Mark Peter Schildmann
DOI:
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摘要: The present invention relates to a method for treating plastic substrates structured by means of laser or generation seed structures on the surface that are suitable subsequent metallization. substrates, after structuring, brought into contact with process solution is removal unintentional deposits arise during structuring. treatment laser-structured mixture wetting agents and compositions support cleaning before metallization leads sufficient unintentionally deposited metal seeds, without having lasting damaging effect planned paths.
lens.org 参考文章(26)
Youhei Suzuki, Yasuyuki Kawano, Toshiya Urakawa, Kunihiro Inada, Circuit board and method of producing the same ,(2002)
Gerhard Prof. Dr. Naundorf, Horst Prof. Dr. Wissbrock, Conducting path structures situated on a non-conductive support material, especially fine conducting path structures and method for producing same ,(1998)
Hidemi Nawafune, Koichi Yomogida, Masaaki Imanari, Masaru Seita, Hideki Tsuchida, Resin composite material and method of forming the same ,(2001)
Mark Lee Stone, Timothy Walter Johnson, Producing metal patterns on a plastic surface ,(1990)
Gerhard Naundorf, Horst Wissbrock, Conductor track structures and method for production thereof ,(2004)
Charles W. C. Lin, Semiconductor chip assembly with bumped molded substrate ,(2000)
Kenji Honda, Aqueous rinsing composition ,(1998)
Peng Zhang, Eugene Joseph Karwacki, Leslie Cox Barber, Danielle Megan King Curzi, Process solutions containing surfactants ,(2003)
Frank N. Cane, Electroless plating process for the manufacture of printed circuit boards ,(1995)
Judith A. Todd-Copley, Stephen M. Copley, Hongyi Tao, Etching process for improving the strength of a laser-machined silicon-based ceramic article ,(1989)