Electrical Signatures of Corrosion and Solder Bond Failure in c-Si Solar Cells and Modules
作者： Reza Asadpour , Xingshu Sun , Muhammad Ashraful Alam
DOI: 10.1109/JPHOTOV.2019.2896898
关键词:
摘要: Moisture- and temperature-activated corrosion of metal fingers, mechanical stress induced delamination, failure solder bonds rank among the leading mechanisms solar modules. The physics moisture ingress, diffusion, reaction have been explored in detail, but electrical implications delamination on specific front-surface grid geometry is not fully understood. In this paper, we show that module efficiency loss due to corrosion, bond (CDS) involves a complex interplay voltage/current redistribution, reflected as photocurrent, well decrease/increase shunt/series resistances. analysis presented paper will redefine interpretation experimental I–V characteristic features degradation mechanisms, integrate variety scattered counter-intuitive results within common theoretical framework, inform CDS-resistant design for
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