A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5
作者： Dapeng Liu , Seungbae Park
DOI: 10.1115/1.4026661
关键词:
摘要: Moisture can have significant effects on the performance and reliability of electronic components. Accurately simulating moisture diffusion is important for designers manufacturers to obtain a realistic evaluation. Beginning with version 14, ANSYS capable related behaviors, such as hygroscopic swelling, newly developed elements. However, normalized approach still required deal discontinuity concentrations at material boundaries, normalization concentration in transient thermal conditions tricky. Case studies shown that normalizing respect timeor temperature-dependent property will lead erroneous results. This paper readdresses issues performing simulations under more general anisothermal (temporally spatially), suggests an easy-to-use cope limitations current users packaging industry. [DOI: 10.1115/1.4026661]
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