Analytical thermal model for multilevel VLSI interconnects incorporating via effect
作者： Ting-Yen Chiang , K. Banerjee , K.C. Saraswat
DOI: 10.1109/55.974803
关键词:
摘要: … have demonstrated the strong influence of vias on the … vias, heat generated in the wire will flow through the vias to the underlying layer. Beyond , heat flows through the ILD and the via …
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