作者: Dylan R. Macmaster
DOI:
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摘要: An integrated circuitry construction comprises a substrate comprising conductive nodes of circuitry. A line structure is above the nodes. Elevationally-extending vias are spaced longitudinally along structure. The individually directly electrically couple to individual material coupled and extending between immediately-longitudinally-adjacent vias. upper insulative below Doped or undoped semiconductor lower immediately- longitudinally-adjacent Other aspects, including method, disclosed.