Monitoring extent of curing and thermal–mechanical property study of printed circuit board substrates

摘要: Abstract Precise control of curing conversion for epoxy-based printed circuit board (PCB) substrates and clarification curing–property relationship are critical the performance reliability assessment, design optimization electronic systems. In this article, various epoxy composites PCB were analyzed by infrared spectroscopy (IR), differential scanning calorimetry (DSC), rheometry, dynamic mechanical analysis (DMA), electron microscope (SEM). Compared with mid-IR DSC, near-IR (NIR) is found to be a reliable method characterization process detecting consumption groups. And DMA powerful measuring materials testing glass transition temperatures ( T g ) viscoelastic properties. The behaviors variety show distinct differences in both rate activation energy, growth tendency also changed depending on material compositions. Correlation versus thermal properties shows that energy at different stage DSC resembles transitions tested DMA. Mechanical close conversions. Peel strength, indicator adhesion strength between copper foil composites, was all specimens conversions, results showed maximum value ca. 90 95%.