Post bump passivation for soft error protection
作者： Timothy H. Daubenspeck , Wolfgang Sauter , Edmund Juris Sprogis , Christopher David Muzzy , Jeffrey Peter Gambino
DOI:
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摘要: A structure and a method for forming the same. The includes (a) providing which (i) dielectric layer, (ii) an electrically conducting bond pad on in direct physical contact with layer top surface, (iii) first passivation surface pad, wherein comprises hole directly above (iv) solder bump filling coupled to pad; (b) second is bump, exposed surrounding ambient immediately after said performed.
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