Semiconductor package having stacked semiconductor chips and method of making the same
作者： Young Wook Heo
DOI:
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摘要: Embodiments of semiconductor packages containing a stack at least two chips are disclosed, along with methods making the same. One embodiment includes substrate, which may be ball grid array substrate or metal leadframe. The is mounted to substrate. Each chip has plurality bond pads on an active surface thereof. first face corresponding ones second chip, and joined thereto through electrically conductive joint. wires extend from each joints Accordingly, pairs interconnected, connected respective wire.
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