Aggregation of Nb filaments in Cu–Nb/Sn composite during low-temperature intermetallic growth
作者： L Luo , Y.G Gong , S.M Gong , S.H Hu
DOI: 10.1016/S0167-577X(97)00279-6
关键词:
摘要: Abstract The solid-state diffusion behavior in the layered Cu–Sn/Cu intermetallic phase system was investigated by using Cu–20 wt.% Nb (filament)/Sn couple at 400–450°C. Very thin filament is used as an inert marker for studying Kirkendall effect-like phenomena. Experimental results show that filaments near interface of Cu–Nb/Sn are shifting toward Cu–Nb side and forming a aggregating zone with concentration up to 27–40 width about 10–15 μm. study proved shift originated from volume expansion caused formation e (Cu3Sn). convoluting or coarsening ribbon-like resulting stress relaxation during annealing plays role driving force aggregation Nb, making density dependent on temperature.
elsevier.com
sci-hub.se 参考文章(11)
J. D. Verhoeven, A. Efron, E. D. Gibson, C. C. Cheng, Void formation in Nb3Sn‐Cu superconducting wire produced by the external tin process Journal of Applied Physics. ,vol. 59, pp. 2105- 2113 ,(1986) , 10.1063/1.336399
James P. Harbison, J. Bevk, Superconducting and mechanical properties ofinsituformed multifilamentary Cu‐Nb3Sn composites Journal of Applied Physics. ,vol. 48, pp. 5180- 5187 ,(1977) , 10.1063/1.323598
Keith R. Karasek, J. Bevk, Normal-state resistivity of in situ-formed ultrafine filamentary Cu-Nb composites Journal of Applied Physics. ,vol. 52, pp. 1370- 1375 ,(1981) , 10.1063/1.329767
R.W Balluffi, L.L Seigle, Growth of voids in metals during diffusion and creep Acta Metallurgica. ,vol. 5, pp. 449- 454 ,(1957) , 10.1016/0001-6160(57)90063-9
J. D. Verhoeven, J. J. Sue, D. K. Finnemore, E. D. Gibson, J. E. Ostenson, The morphology and grain size of Nb3Sn filaments in in situ prepared multifilamentary Nb3Sn-Cu composite wire Journal of Materials Science. ,vol. 15, pp. 1907- 1914 ,(1980) , 10.1007/BF00550616
D. K. Finnemore, J. E. Ostenson, J. D. Verhoeven, E. D. Gibson, Superconducting properties of in situ–processed Nb3/Sn‐Cu composites Journal of Applied Physics. ,vol. 51, pp. 1714- 1718 ,(1980) , 10.1063/1.327781
L.S. Chumbley, H.L. Downing, W.A. Spitzig, J.D. Verhoeven, Electron microscopy observation of an in situ CuNb composite Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 117, pp. 59- 65 ,(1989) , 10.1016/0921-5093(89)90086-5
R.W Balluffi, The supersaturation and precipitation of vacancies during diffusion Acta Metallurgica. ,vol. 2, pp. 194- 202 ,(1954) , 10.1016/0001-6160(54)90159-5
J.A Brinkmanf, Mechanism of pore formation associated with the Kirkendall effect Acta Metallurgica. ,vol. 3, pp. 140- 145 ,(1955) , 10.1016/0001-6160(55)90082-1
D. Easton, D. Kroeger, Kirkendall voids--A detriment to Nb 3 Sn superconductors IEEE Transactions on Magnetics. ,vol. 15, pp. 178- 181 ,(1979) , 10.1109/TMAG.1979.1060094