作者: B.J. Rubin
DOI: 10.1109/TMTT.1984.1132716
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摘要: This paper investigates the propagation characteristics of signal lines situated between a pair mesh reference planes in homogeneous dielectric. These planes, which form heart high-performance multichip modules, provide transmission-line environment for signals carried integrated circuit chips. A numerical solution that employs set rooftop functions to represent current density is developed and used find velocity characteristic impedance plane structures where conductors have zero thickness finite sheet resistance. The telegraphist's equations are shown apply, capacitance inductance matrices coupled fine configurations. near- far-end crosstalk calculated when on same, opposite, sides plane. presence run direction orthogonal lines, whether as an array crossing or part significantly affect only capacitive parameters. influence such velocity, impedance, given, detailed plot clearly indicates circulating flow these lines.