作者: Koichi Kondo , Satoshi Arai , Takayoshi Konishi , Shigeyoshi Yoshida
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摘要: An EBG (Electromagnetic Bandgap) structure includes a magnetic material portion at least in part. It is preferable to arrange the close or, if possible, contact with conductor forming structure, for example, of ground conductor, producing capacitance, and/or an inductance, such as via. Examples include ferrite plating film, composite layer including powder and resin binder, like.