Separation and validation of bond-wire and solder layer failure modes in IGBT modules
作者： Wenzhao Liu , Dao Zhou , Francesco Iannuzzo , Michael Hartmann , Frede Blaabjerg
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摘要: … approach to separate the failure modes of IGBT modules. This paper proposes a new online method to separate the failure modes of IGBT power modules. The novel aspects are …
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