摘要: We employed anisotropic etching of single crystal silicon wafers for the fabrication of micron- scale optical elements. We have succeeded in producing silicon lenses with a geometry suitable for 1-d focusing x-ray optics. These lenses have an aspect ratio (40:1) suitable for x- ray reflection and have very good optical surface alignment. We have developed a number of process refinements which improved the quality of the lens geometry and the repeatability of the etch process. A significant progress was made in obtaining good optical surface quality. The RMS roughness was decreased from 110 angstroms for our initial lenses to 30 angstroms in the final lenses. A further factor of three improvement in surface quality is required for the production of efficiency x-ray optics. We present new wafer geometries designed to test the effect of the etch process on surface roughness.
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