Direct on chip thermal measurement in IGBT modules using FBG technology—Sensing head interfacing

摘要: This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in-situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction temperature. Two sensor interfacing configurations are evaluated by means of Finite Element simulations and experiments on a purpose designed laboratory test system. Experiments show the feasibility on the use of FBG sensing technology for reliable and effective real-time measurement of the junction temperature in a wide operating envelope of the tested IGBT device.