Three-sensor 3ω-2ω method for the simultaneous measurement of thermal conductivity and thermal boundary resistance in film-on-substrate heterostructures

摘要: Solid heterostructures composed of substrates and epitaxial films are extensively used in advanced technologies, and their thermophysical properties fundamentally determine the performance, efficiency, and reliability of the corresponding devices. However, an experimental method that is truly appropriate for the thermophysical property measurement of solid heterostructures is still lacking. To this end, a three-sensor 3ω-2ω method is proposed, which can simultaneously measure the thermal conductivities of the film and the substrate, along with the film-substrate thermal boundary resistance (TBR) in a single solid heterostructure without any reference samples, showing broad applicability for miscellaneous heterostructures with film thickness ranging from 100 nm to 10 μm. In this method, three parallel metal sensors with unequal widths and distances conforming to guidelines for the three-sensor layout design are …