EDFAS FA TECHNOLOGY ROADMAP DIE-LEVEL ROADMAP COUNCIL (DLRC) POST-ISOLATION DOMAIN TECHNICAL REPORT-JAN 2023

摘要: Semiconductor technologies are advancing at a rapid pace, with ongoing developments in logic and memory scaling, the introduction of new materials and transistor architectures, and the integration of advanced packaging heterogeneous technologies such as Chiplets, 2.5 D, and 3D into mainstream devices. As these technologies evolve, failure analysis (FA) becomes increasingly critical in enabling new innovations. With the complexity of process scaling no longer limited to pure device shrinkage, the challenges of die-level failure analysis have grown significantly. To address these challenges, Die-Level Roadmap Council (DLRC) Post-Isolation Domain Council was established. The objective of the council is to consolidate the challenges and develop a roadmap for addressing them in a comprehensive and strategic manner.