Analysis of thermal residual stresses distribution in circular and elliptical bonded composite repair of metallic cracked structures

摘要: In this study, the distribution of the thermal residual stresses due to the adhesive curing in elliptical and circular bonded composite repairs is analyzed using the finite element method. The computation of these stresses comprises all components of the structures: cracked plate, composite patch and adhesive layer. In addition, the influence of these residual stresses on the repair performance is highlighted by analyzing their effect on the stress intensity factor at the crack tip. The obtained results show that the normal thermal stresses in the plate and the patch are significant.. The presence of the thermal stresses increases the stress intensity factor at the crack tip which reduce the repair efficiency.