Multi-die assembly

摘要: A multi-chip integrated circuit assembly including embodiments having a plurality of integrated circuits connected thereto. According to one embodiment, a multi-chip assembly (100) may include a first surface (102) having first surface connections (106) and a second surface (104) having second surface connections (108). A first surface (102) may be lower than a second surface (104). First and/or second surface connections (106 and 108) may have conductive paths to one another and/or to assembly connections (110). In one particular arrangement, first and second surface connections (106 and 108) may provide “flip-chip” type connections to integrated circuits. Assembly connections (110) may provide a ball grid array (BGA) type connection for the multi-chip assembly (100).