F. P. Incropera , S. Ramadhyani
Cooling of Electronic Systems 507 -537
T. J. Heindel , S. Ramadhyani , F. P. Incropera
Journal of Electronic Packaging 114 ( 1) 63
D. J. Womac , S. Ramadhyani , F. P. Incropera
Journal of Heat Transfer 115 ( 1) 106
F.P. Incropera , J.S. Campbell
F.P. Incropera , J.F. Thomas
F.P. Incropera , R. Viskanta , G.D. Fetters
Am. Soc. Mech. Eng., (Pap.); (United States)
F.P. Incropera , W.W. Bower
F.P. Incropera , G. Leppert
ISA (Instrum. Soc. Amer.) Trans., 6: 35-41(Jan. 1967).
F.P. Incropera , P.J. Prescott
F.P. Incropera , W.W. Bower
F.P. Incropera , Christenson
F.P. Incropera , P.J. Prescott
F.E. Pfefferkorn , F.P. Incropera , Y.C. Shin , J.C. Rozzi
American Society of Mechanical Engineers, New York, NY (US)
T.J. Heindel , F.P. Incropera , S. Ramadhyani
International Journal of Heat and Fluid Flow 16 ( 6) 511 -518
T.J. Heindel , S. Ramadhyani , F.P. Incropera
International Journal of Heat and Fluid Flow 16 ( 6) 501 -510
F.P. Incropera , M.A. Yaghoubi
International Journal of Heat and Mass Transfer 23 ( 3) 269 -278
T.L. Bergman , F.P. Incropera , R. Viskanta
International Journal of Heat and Mass Transfer 25 ( 9) 1411 -1418
L.K. Matthews , R. Viskanta , F.P. Incropera
International Journal of Heat and Mass Transfer 27 ( 4) 487 -495
D.G. Neilson , F.P. Incropera
International Journal of Heat and Mass Transfer 31 ( 3) 660 -663
W.D. Bennon , F.P. Incropera
International Journal of Heat and Mass Transfer 31 ( 10) 2147 -2160