Development of High-Voltage Vertical GaN PN Diodes

K. Hobart , M. Ebrish , A. A. Allerman , A. Jacobs
international electron devices meeting

5
2020
Perceived Constraints of Farm Scientists in State Agricultural Universities, West Bengal

Chandan Kumar Panda , S. Chowdhury
Economic Affairs 60 ( 3) 479 -486

2015
Ultrawide‐Bandgap Semiconductors: Research Opportunities and Challenges

J. Y. Tsao , S. Chowdhury , M. A. Hollis , D. Jena
Advanced electronic materials 4 ( 1) 1600501

850
2018
P-i-n diodes enabled by homoepitaxially grown phosphorus doped diamond with breakdown electric field >1.25 MV/cm

M. Dutta , F.A.M. Koeck , R.J. Nemanich , S. Chowdhury
device research conference 184 -184

10
2015
Enhancing Quality of Learning Experience Through Intelligent Agent in E-Learning

S Bhattacharya , S. , Roy , S.
International Journal of Uncertainty, Fuzziness and Knowledge-Based Systems 25 ( 01) 31 -52

1
2017
Schottky Barrier Height Analysis of Diamond SPIND Using High Temperature Operation up to 873 K

M. Malakoutian , M. Benipal , F. A. Koeck , R. J. Nemanich
IEEE Journal of the Electron Devices Society 8 614 -618

1
2020
m

S. Chowdhury

Design of an aerosol filtration apparatus based on pulse-jet cleaning

A Mukhopadhyay , S Chowdhury , I C Sharma
IJFTR Vol.25(3) [September 2000]

2
2000
Observation and discussion of avalanche electroluminescence in GaN p-n diodes offering a breakdown electric field of 3 MV cm−1

S Mandal , M B Kanathila , C D Pynn , W Li
Semiconductor Science and Technology 33 ( 6) 065013

7
2018
Ultra lowqa discharge experiments in the SINP tokamak

A N Sekar Iyengar , S K Majumdar , J Basu , R K Paul
Pramana 39 ( 2) 181 -191

7
1992
N3XT 3D Technology Foundations and Their Lab-to-Fab: Omni 3D Logic, Logic+ Memory Ultra-Dense 3D, 3D Thermal Scaffolding

T Srimani , A Bechdolt , S Choi , C Gilardi
2023 International Electron Devices Meeting (IEDM) 1 -4

2023
High Temperature Diamond Electronics for Actuators and Sensors

RJ Nemanich , M Malakoutian , H Surdi , M Benipal
17th Meeting of the Venus Exploration Group (VEXAG) 17 ( 2193) 8025 -8025

1
2019
Thermal dissipation in stacked devices

WY Woon , Sam Vaziri , CC Shih , I Datye
2023 International Electron Devices Meeting (IEDM) 1 -4

2023
Novel all-around diamond integration with GaN HEMTs demonstrating highly efficient device cooling

R Soman , M Malakoutian , B Shankar , D Field
2022 International Electron Devices Meeting (IEDM) 30.8. 1 -30.8. 4

11
2022
Interlayer Engineering to Achieve< 1 m 2 K/GW Thermal Boundary Resistances to Diamond for Effective Device Cooling

K Woo , M Malakoutian , Y Jo , X Zheng
2023 International Electron Devices Meeting (IEDM) 1 -4

1
2023
20 kV Gallium Nitride Electromagnetic Pulse Arrestor for Grid Reliability.

Robert Kaplar , Andrew A Allerman , Brendan Patrick Gunning , Gregory Pickrell
Sandia National Lab.(SNL-NM), Albuquerque, NM (United States) ( SAND2019-6902PE)

4
2019
Progress in Fabrication and Characterization of Vertical GaN Power Devices

Robert Kaplar , Andrew Binder , Mary Crawford , Andrew Allerman
Sandia National Lab.(SNL-NM), Albuquerque, NM (United States) ( SAND2022-1974C)

2022
Recent Progress in Vertical Gallium Nitride Power Devices.

Robert Kaplar , Andrew Allerman , Mary Crawford , Brendan Gunning
Sandia National Lab.(SNL-NM), Albuquerque, NM (United States) ( SAND2021-14995C)

2021
Vertical GaN PN Diodes for Grid Resiliency and Medium-Voltage Power Electronics.

Robert Kaplar , Andrew Allerman , Mary Crawford , Brendan Gunning
Sandia National Lab.(SNL-NM), Albuquerque, NM (United States) ( SAND2021-12549C)

2021