引用次数
引用: 2,485
H-指数: 28
I10-指数 : 51
出版物: 107
The importance of 2D aggregates on the antimicrobial resistance of Staphylococcus aureus sessile bacteria.
A Miñán , Patricia Laura Schilardi , M Fernández Lorenzo De Mele ,
Materials Science and Engineering: C 61 199 -206
5
2016
Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution.: Part I. Identification of products and reaction pathway
A.E. Bolzán , A.S.M.A. Haseeb , P.L. Schilardi , R.C.V. Piatti
Journal of Electroanalytical Chemistry 500 ( 1) 533 -542
42
2001
Surface-relief micropatterning of zinc oxide substrates by micromolding pulsed-laser-deposited films
O. Azzaroni , P.L. Schilardi , R.C. Salvarezza , J. Manuel-Herrero
Applied Physics A 81 ( 6) 1113 -1116
7
2005
Electronic and magnetic properties of C60 thin films under ambient conditions: A multitechnique study
O Amelines-Sarria , PC dos Santos Claro , PL Schilardi , B Blum
Organic Electronics 12 ( 9) 1483 -1492
14
2011
The development of 2D copper branched aggregates
P.L. Schilardi , S.L. Marchiano , R.C. Salvarezza , A.J. Arvia
Chaos Solitons & Fractals 6 525 -529
3
1995
Synergistic antimicrobial effect against early biofilm formation: micropatterned surface plus antibiotic treatment
C Díaz , A Miñán , PL Schilardi , M Fernández Lorenzo De Mele
International Journal of Antimicrobial Agents 40 ( 3) 221 -226
16
2012
Have flagella a preferred orientation during early stages of biofilm formation?: AFM study using patterned substrates.
C Díaz , PL Schilardi , RC Salvarezza , M Fernández Lorenzo de Mele
Colloids and Surfaces B: Biointerfaces 82 ( 2) 536 -542
54
2011
Metal electrodeposition on self-assembled monolayers: a versatile tool for pattern transfer on metal thin films
O. Azzaroni , P.L. Schilardi , R.C. Salvarezza
Electrochimica Acta 48 ( 20) 3107 -3114
46
2003
Comparative voltammetric and FTIRRAS study on the electro-oxidation of thiourea and methyl-thioureas on platinum in aqueous acid solutions
A.E. Bolzán , P.L. Schilardi , R.C.V. Piatti , T. Iwasita
Journal of Electroanalytical Chemistry 571 ( 1) 59 -72
15
2004
Kinetics and growth modes of quasi-2d silver branched electrodeposits produced in the presence of a supporting electrolyte
P.L. Schilardi , S.L. Marchiano , R.C. Salvarezza , A. Hernandez Creus
Journal of Electroanalytical Chemistry 431 ( 1) 81 -98
13
1997
Spontaneous adsorption of silver nanoparticles on Ti/TiO2 surfaces. Antibacterial effect on Pseudomonas aeruginosa.
C.Y. Flores , C. Diaz , A. Rubert , G.A. Benítez
joint international conference on information sciences 350 ( 2) 402 -408
184
2010
Anodisation of copper in thiourea-containing acid solution - Part II. In situ transversal imaging observations. Kinetics of anodic film growth
A.S.M.A Haseeb , P.L Schilardi , A.E Bolzan , R.C.V Piatti
Journal of Electroanalytical Chemistry 500 ( 1) 543 -553
25
2001
Decrease in cytotoxicity of copper-based intrauterine devices (IUD) pretreated with 6-mercaptopurine and pterin as biocompatible corrosion inhibitors.
Florencia Alvarez , ClaudiaA. Grillo , PatriciaL. Schilardi , Aldo Rubert
ACS Applied Materials & Interfaces 5 ( 2) 249 -255
12
2013
Electrocatalytic and Magnetic Properties of Ultrathin Nanostructured Iron–Melanin Films on Au(111)
Alejandro González Orive , Patricio Dip , Yurima Gimeno , Pilar Díaz
Chemistry: A European Journal 13 ( 2) 473 -482
13
2007
Molding and replication of ceramic surfaces with nanoscale resolution.
Maria A. Auger , Patricia L. Schilardi , Ignacio Caretti , Olga Sánchez
Small 1 ( 3) 300 -309
28
2005
Microorganismos que afectan diferentes soportes de información
S.G. Gómez de Saravia , P. Schilardi , P. S. Guiamet , P. Lavin
Revista Argentina De Microbiologia 41 ( 2) 117 -117
2009
Evolution of the Growth Front for Copper Electrodeposition Followed by Real Time Imaging
P. Schilardi , S. Méndez , R. C. Salvarezza , A. J. Arvia
Langmuir 14 ( 15) 4308 -4314
23
1998
Dynamic Scaling Exponents of Copper Electrodeposits from Scanning Force Microscopy Imaging. Influence of a Thiourea Additive on the Kinetics of Roughening and Brightening
S. Mendez , G. Andreasen , P. Schilardi , M. Figueroa
Langmuir 14 ( 9) 2515 -2524
53
1998
Topographic Changes of Polycrystalline Ag and Cu Electrodes in Acid Aqueous Solutions Resulting from a Prolonged Application of the Potential Reversal Technique
P. Carro , A. Hernández Creus , P. Schilardi , S. González
Journal of The Electrochemical Society 143 ( 7) 2294 -2305
4
1996
The influence of operating conditions on the morphology of tin electrodeposits and tinplate quality
S.L. Marchiano J.L. Zubimendi , C. Baieli , W. Egli , M. Chara
The Sixth Tinplate Conference, London 85 -94
12
1996