Anodisation of copper in thiourea-containing acid solution - Part II. In situ transversal imaging observations. Kinetics of anodic film growth
作者： A.S.M.A Haseeb , P.L Schilardi , A.E Bolzan , R.C.V Piatti , R.C Salvarezza
DOI: 10.1016/S0022-0728(00)00216-3
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摘要: Abstract The formation of anodic films during the anodisation copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing amounts dissolved thiourea was investigated following corroding electrode profile by on line situ imaging. For E 0.07 V, main reactions are electro-decomposition formamidine disulphide and Cu(I)–thiourea complexes yielding a copper sulphide-containing film (film II) electrodissolution as Cu(II) ions through II. relative contribution these processes depends concentration solution, electric potential time. growth kinetics I II were determined from evolution average height 〈h〉 obtained fit parabolic rate law, whereas those approach linear versus time relationship. rupture assists localised corrosion copper. Likely physical mechanisms for discussed.
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