A Wide-band On-chip Passive Equalizer for 30 Gbps Serial Data Transmission
Heegon Kim , Joungho Kim , Jun So Pak , Jonghyun Cho
대한전자공학회 ISOCC 65 -65
2012
Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models
Heegon Kim , Joungho Kim , Jun So Pak , Jonghyun Cho
design automation and test in europe
2011
Noise Coupling and Shielding in Through-Silicon Via (TSV)-based 3D IC
Jonghyun Cho , Joohee Kim , Jun So Pak , Junho Lee
asia-pacific symposium on electromagnetic compatibility
1
2011
Electromagnetic Interference Analysis of an Inhomogeneous Electromagnetic Bandgap Power Bus for High-Speed Circuits.
Myunghoi Kim , Jonghyun Cho
Journal of information and communication convergence engineering 15 ( 4) 237 -243
2017
Si-interposer Design for GPU-Memory Integration concerning the Signal Integrity
Lee-Sup Kim , Hyuncheol Bae , Seungwook Paek , Joungho Kim
2013 Design Con
8
2013
Slow wave and dielectric quasi-TEM modes of Metal-Insulator-Semiconductor (MIS) structure Through Silicon Via (TSV) in signal propagation and power delivery in 3D chip package
Jun So Pak , Jonghyun Cho , Joohee Kim , Junho Lee
electronic components and technology conference 667 -672
45
2010
Precise RLGC modeling and analysis of through glass via (TGV) for 2.5D/3D IC
Jihye Kim , Insu Hwang , Youngwoo Kim , Jonghyun Cho
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 254 -259
8
2015
Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer
Youngwoo Kim , Jonghyun Cho , Kiyeong Kim , Venky Sundaram
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 738 -743
20
2015
Noise coupling emulation between TSV and active circuit through metal oxide patch
Manho Lee , Jonghyun Cho , Jaemin Lim , Joungho Kim
electronic components and technology conference 1945 -1949
2015
Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer
Youngwoo Kim , Jonghyun Cho , Jinwook Song , Subin Kim
electronic components and technology conference 1856 -1861
2
2016
A through-silicon-via to active device noise coupling study for CMOS SOI technology
Xiaomin Duan , Xiaoxiong Gu , Jonghyun Cho , Joungho Kim
electronic components and technology conference 1791 -1795
6
2011
High-frequency measurements of TSV failures
Joohee Kim , Daniel Jung , Jonghyun Cho , Jun So Pak
electronic components and technology conference 298 -303
10
2012
Thermal effects on through-silicon via (TSV) signal integrity
Manho Lee , Jonghyun Cho , Joohee Kim , Jun So Pak
electronic components and technology conference 816 -821
8
2012
Nonlinear effects of TSV and harmonic generation
Jonghyun Cho , Joohee Kim , Jun So Pak , Junho Lee
electronic components and technology conference 834 -838
5
2012
Power delivery network analysis of 3D double-side glass interposers for high bandwidth applications
Gokul Kumar , Srikrishna Sitaraman , Jonghyun Cho , Sung Jin Kim
electronic components and technology conference 1100 -1108
7
2013
Noise coupling of through-via in silicon and glass interposer
Manho Lee , Jonghyun Cho , Joohee Kim , Joungho Kim
electronic components and technology conference 1806 -1810
5
2013
Noise Coupling and Shielding in 3D ICs
Jonghyun Cho , Jun So Pak , Joungho Kim
Electrical Design of Through Silicon Via 115 -146
2014
Channel design for wide system bandwidth in a TSV based 3D IC
Heegon Kim , Jonghyun Cho , Joohee Kim , Myunghoi Kim
workshop on signal propagation on interconnects 57 -60
7
2011
Simultaneous switching noise coupling through via transition for a CMOS negative feedback Operational Amplifier in System-in-Package
Bumhee Bae , Yujeong Shim , Jonghyun Cho , Joungho Kim
international midwest symposium on circuits and systems 1 -4
2011
Measurement and Analysis of a High-Speed TSV Channel
Heegon Kim , Jonghyun Cho , Myunghoi Kim , Kiyeong Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 ( 10) 1672 -1685
59
2012