Channel design for wide system bandwidth in a TSV based 3D IC
作者： Heegon Kim , Jonghyun Cho , Joohee Kim , Myunghoi Kim , Junho Lee
关键词:
摘要: … If we use the developed TSV model [2], the GSG-type TSV can be … these tendencies of the resistance and capacitance with varying back-side RDL width are similar with the case of TSV …
sci-hub.se 参考文章(3)
Garrett W. Hall, Stephen H. Hall, James A. McCall, High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices ,(2000)
Joohee Kim, Jonghyun Cho, Jun So Pak, Taigon Song, Joungho Kim, Hyungdong Lee, Junho Lee, Kunwoo Park, None, I/O power estimation and analysis of high-speed channels in through-silicon via (TSV)-based 3D IC 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems. pp. 41- 44 ,(2010) , 10.1109/EPEPS.2010.5642539
Erli Chen, S.Y. Chou, Characteristics of coplanar transmission lines on multilayer substrates: modeling and experiments IEEE Transactions on Microwave Theory and Techniques. ,vol. 45, pp. 939- 945 ,(1997) , 10.1109/22.588606