ESD/antenna diodes for through-silicon vias

Qing Su , Min Ni , ZongWu Tang , Jamil Kawa

232
2012
An analytical study on the role of thermal TSVs in a 3DIC chip stack

Min Ni , Qing Su , Zongwu Tang , Jamil Kawa
Date Workshop for 3D Integration

28
2010
Efficient Design Practices for Thermal Management of TSV based 3D IC System

Min Ni , Qing Su , Zongwu Tang , Jamil Kawa
2010 Intrenational Symposium on Phycical Design (2010ISPD)

8
2010
Banded computation architectures

Min Ni , ZongWu Tang , Qing Su

5
2014
Glitch source identification and ranking

Vaibhav Jain , Solaiman Rahim , Myunghoon Yoon , Qing Su

2
2023
ESD/antenna diodes for through-silicon vias

Qing Su , Min Ni , ZongWu Tang , Jamil Kawa

2
2015
ESD/antenna diodes for through-silicon vias

Jamil Kawa , Min Ni , James D Sproch , Qing Su

2
2014
Vector generation for maximum instantaneous peak power

Youxin Gao , Qing Su , Mayur Bubna

1
2022
Enhanced glitch estimation in vectorless power analysis

Qing Su , Pankaj Singla , Solaiman Rahim , Eduard Petrus Huijbregts

2024
Formation of vanadium oxides with various morphologies by chemical vapor deposition

Q. Su , C.K. Huang , Y. Wang , Y.C. Fan
Journal of Alloys and Compounds 475 ( 1-2) 518 -523

82
2009
Mechanical Response of He-Implanted Amorphous SiOC/Crystalline Fe Nanolaminates.

A. Zare , Q. Su , J. Gigax , T. A. Harriman
Scientific Reports 9 ( 1) 1 -13

17
2019
12
2017
Effects of ion irradiation on chemical and mechanical properties of magnetron sputtered amorphous SiOC

A. Zare , Q. Su , J. Gigax , S.A. Shojaee
Nuclear Instruments & Methods in Physics Research Section B-beam Interactions With Materials and Atoms 446 10 -14

2
2019
Study of BaCe0.4Zr0.4Y0.2O3-δ/BaCe0.8Pr0.2O3-δ (BCZY/BCP) bilayer membrane for Protonic Conductor Solid Oxide Fuel Cells (PC-SOFC)

J. Basbus , M. Arce , H. Troiani , Q. Su
International Journal of Hydrogen Energy 45 ( 8) 5481 -5490

11
2020
A min-variance iterative method for fast smart dummy feature density assignment in chemical-mechanical polishing

Xin Wang , C.C. Chiang , J. Kawa , Qing Su
international symposium on quality electronic design 258 -263

21
2005
Accurate Modeling of Substrate Coupling Without Grounded Backplates

Q Su , J Kawa , C Chiang , Y Massoud
Proceedings of IEEE International System-On-Chip Conference

9
2003