Optimization of flip-chip laser soldering for low temperature stability substrate

Gordon , Balogh , Hurtony
european microelectronics and packaging conference 1 -6

1
2009
INVESTIGATION OF ALLOTROPIC β→α-Sn TRANSITION IN HIGH TIN CONTENT SOLDER ALLOYS WITH DIFFERENT MICROSCOPY AND SPECTROSCOPY TECHNIQUES

Tamás Hurtony , Agata Skwarek , Gábor Harsányi , Piotr Zachariasz
Acta Materialia Turcica 4 ( 1) 20 -28

2020
Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers

Olivér Krammer , Olivér Krammer , Tamás Hurtony , David Busek
Vacuum 187 110121

2021
Reliability studies of InnoLot and SnBi joints soldered on DBC substrate

Agata Skwarek , Balázs Illés , Krzysztof Witek , Tamás Hurtony
Soldering & Surface Mount Technology 30 ( 4) 205 -212

2
2018
Characterization of the microstructure of tin-silver lead free solder

Tamás Hurtony , Alex Szakál , László Almásy , Adél Len
Journal of Alloys and Compounds 672 13 -19

13
2016
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films.

Balázs Illés , Tamás Hurtony , Olivér Krammer , Bálint Medgyes
Materials 12 ( 21) 3609

5
2019
Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies.

Agata Skwarek , Przemysław Ptak , Krzysztof Górecki , Tamás Hurtony
Materials 13 ( 7) 1563

17
2020
Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb.

Agata Skwarek , Balázs Illés , Tamás Hurtony , David Bušek
Materials 13 ( 4) 968

1
2020
Mangán mikroötvözős forraszanyag mikroszerkezetének vizsgálata elektrokémiai módszerekkel

Tamás Hurtony , Olivér Krammer
Elektronikai Technológia és Gyártásinformatika 1 ( 1) 13 -18

2018
Mössbauer studies of β → α phase transition in Sn-rich solder alloys

Piotr Zachariasz , Agata Skwarek , Balázs Illés , Jan Żukrowski
Microelectronics Reliability 82 ( 82) 165 -170

8
2018
Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates.

Tamás Hurtony , Oliver Krammer , Balázs Illés , Gábor Harsányi
Materials 13 ( 22) 5251

2020
Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Olivér Krammer , Tamás Garami , Barbara Horváth , Tamás Hurtony
Journal of Alloys and Compounds 634 156 -162

21
2015
Whisker growth from vacuum evaporated submicron Sn thin films

Balázs Illés , Agata Skwarek , Réka Bátorfi , Jacek Ratajczak
Surface & Coatings Technology 311 216 -222

9
2017
Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM

Tamás Hurtony , Attila Bonyár , Péter Gordon , Gábor Harsányi
Microelectronics Reliability 52 ( 6) 1138 -1142

30
2012
Kinetics of Sn whisker growth from Sn thin-films on Cu substrate

Balázs Illés , Olivér Krammer , Tamás Hurtony , Karel Dušek
Journal of Materials Science: Materials in Electronics 31 ( 19) 16314 -16323

9
2020
Assessment of distribution of pellets in tablets by non-destructive microfocus X-ray imaging and image analysis technique

Zsombor Csobán , Barnabás Kállai-Szabó , Nikolett Kállai-Szabó , Tamara Takács
Powder Technology 301 228 -233

4
2016
Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys

Balázs Illés , Tamás Hurtony , Bálint Medgyes
Corrosion Science 99 313 -319

13
2015
Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components

Dániel Straubinger , Tamás Hurtony , Attila Géczy
Journal of Materials Research and Technology 21 308 -318

4
2022
Application of ZnO nanoparticles in Sn99Ag0. 3Cu0. 7-based composite solder alloys

Agata Skwarek , Olivér Krammer , Tamás Hurtony , Przemysław Ptak
Nanomaterials 11 ( 6) 1545

16
2021