Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers
作者： Olivér Krammer , Olivér Krammer , Tamás Hurtony , David Busek , Balázs Illés
DOI: 10.1016/J.VACUUM.2021.110121
关键词:
摘要: Abstract In the past years, use of low silver content SAC0307 (99Sn0.3Ag0.7Cu wt%) solder alloy grew considerably due to its good soldering quality. latest version this alloy, manganese, and bismuth are used improve further parameters. study, a reliability issue, whisker growth from SAC0307-Mn07 SAC0307-Bi1-Mn07 alloys was investigated. Ultra-thin films (in 100–150 nm thickness) were vacuum evaporated investigated onto Cu substrates. The samples stored at laboratory conditions for 28 days. Whisker followed by scanning electron microscope, ultra-thin film layers structures in focused ion beam cuts. case SAC0307-Mn07, mechanical stress intermetallic layer resulted formation right after deposition. However, Bi addition could increase relaxation ability layer; started only three days evaporation layer. Besides, entirely suppress filament-type whiskers that might cause issues microelectronics. Furthermore, unique phenomenon observed produced mostly Bi–Sn couples.
sci-hub.st 参考文章(41)
Balázs Illés, Tamás Hurtony, Bálint Medgyes, Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys Corrosion Science. ,vol. 99, pp. 313- 319 ,(2015) , 10.1016/J.CORSCI.2015.07.026
Balazs Illes, Norbert Fehervari, Relation between tin whiskering ability Sn/Ag/Cu solder alloys and current load international spring seminar on electronics technology. pp. 173- 178 ,(2015) , 10.1109/ISSE.2015.7247984
Erika R Crandall, Factors Governing Tin Whisker Growth ,(2013)
Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan, Alloying modification of Sn–Ag–Cu solders by manganese and titanium Microelectronics Reliability. ,vol. 49, pp. 235- 241 ,(2009) , 10.1016/J.MICROREL.2008.10.001
Influence of copper diffusion on the shape of whiskers grown on bright tin layers Microelectronics Reliability. ,vol. 53, pp. 1009- 1020 ,(2013) , 10.1016/J.MICROREL.2013.03.008
B.-Z. Lee, D.N. Lee, Spontaneous growth mechanism of tin whiskers Acta Materialia. ,vol. 46, pp. 3701- 3714 ,(1998) , 10.1016/S1359-6454(98)00045-7
RZ Hu, MQ Zeng, M Zhu, None, Cyclic durable high-capacity Sn/Cu6Sn5 composite thin film anodes for lithium ion batteries prepared by electron-beam evaporation deposition Electrochimica Acta. ,vol. 54, pp. 2843- 2850 ,(2009) , 10.1016/J.ELECTACTA.2008.11.021
Balázs Illés, Barbara Horváth, Tin whisker growth from micro-alloyed SAC solders in corrosive climate Journal of Alloys and Compounds. ,vol. 616, pp. 116- 121 ,(2014) , 10.1016/J.JALLCOM.2014.07.103
Wei Zhou, Hongbo Zhang, Ping Wu, Whisker growth in Sn and SnPb thin films under electromigration Vacuum. ,vol. 107, pp. 103- 107 ,(2014) , 10.1016/J.VACUUM.2014.04.010
Mohammad Aljarrah, Mahmoud Rababah, Awni Itradat, Ahmad Almagableh, Suleiman Obeidat, Rami Hikmat Fouad, Thermodynamic calculations of the Mn–Sn, Mn–Sr and Mg–Mn–{Sn, Sr} systems Iet Science Measurement & Technology. ,vol. 9, pp. 681- 692 ,(2015) , 10.1049/IET-SMT.2013.0267