REMOVING AN ORGANIC SACRIFICIAL MATERIAL FROM A 2D MATERIAL
作者： Chan Boon Teik , De Marneffe Jean-Francois , Asselberghs Inge , Marinov Daniil , Lin Han Chung
DOI:
关键词: Chemical engineering 、 Ceramic 、 Layer (electronics) 、 Substrate (printing) 、 Materials science
摘要: In a first aspect, the present invention relates to method for removing an organic sacrificial material (301) from 2D (200), comprising: (a) providing target substrate (120) having thereon (200) and layer of over (b) infiltrating with metal or ceramic (311), (c) (301).
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