Method for connecting circuit boards
作者： Hiroshi Matsubara , Takashi Nukii
DOI:
关键词: Optoelectronics 、 Printed circuit board 、 Materials science 、 Adhesive 、 Electrode 、 Electrical engineering 、 Electrical conductor
摘要: A method for connecting circuit boards in which a first board having electrodes is superposed on second of are formed positions corresponding to the so that and electrically connected with each other, comprising step applying photocuring adhesive residual regions not formed, irradiating light from surface opposite cure third adhering particles conductive at least outer peripheral surfaces by means uncured adhesive, fourth superposing adhered connect other through particles, provided opaque light-transmissive.
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