Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
作者： Motohiro Arifuku , Yasushi Gotou , Itsuo Watanabe , Kouji Kobayashi , Kazuyoshi Kojima
DOI:
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摘要: The present invention is a circuit connecting material used for the mutual connection of member in which electrodes and insulating layers are formed adjacent to each other on surface board, with edge parts being greater thickness than basis main surfaces, wherein this contains bonding agent composition conductive particles that have mean particle size 1 μm or but less 10 hardness 1.961 6.865 GPa, exhibits storage elastic modulus 0.5 3 GPa at 40° C. coefficient thermal expansion 30 200 ppm/° from 25° 100° when subjected curing treatment.
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