Effects of Interfacial Films on Thermal Stresses in Whisker Reinforced Ceramics

作者: CHUN-HWAY HSUEH , PAUL F. BECHER , PETER ANGELINI

DOI: 10.1111/J.1151-2916.1988.TB07560.X

关键词: Monocrystalline whiskerThermal expansionCeramicWhiskerMaterials scienceModulusMulliteComposite materialBrittlenessYoung's modulus

摘要: Toughening of whisker-reinforced (or fiber-reinforced) ceramics by whisker pullout requires debonding at the whisker/matrix interface. Compressive clamping stresses, which would inhibit interface and/or pullout, are expected in composites where matrix has a higher thermal expansion coefficient than whisker. Because such mismatch thermomechanical properties can result brittle composites, it is important to explore approaches modify stresses composites. As result, effects film on due contraction upon cooling considered this study. Analysis various for systems, particular SiC/Al2O3, SiC/cordierite, and SiC/mullite Reduction shown occur when interfacial low Young's modulus. Also, lower (e.g., SiC/Al2O3), generated during decrease as increases.

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