Effect of alumina nanoparticles on the microstructure and mechanical durability of meltspun lead-free solders based on tin alloys
作者： K. Mehrabi , F. Khodabakhshi , E. Zareh , A. Shahbazkhan , A. Simchi
DOI: 10.1016/J.JALLCOM.2016.06.296
关键词: Microstructure 、 Alloy 、 Nanocomposite 、 Eutectic system 、 Ultimate tensile strength 、 Metallurgy 、 Solderability 、 Melt spinning 、 Materials science 、 Soldering
摘要: Abstract As one of the key technologies for high performance electronic devices, composite solders have been recently developed to improve thermal and mechanical properties solder joints. In this research, melt spinning was employed fabricate a lead-free based nanocomposite application materials via introducing Ni-coated Al 2 O 3 nanoparticles (0.1 wt%) into Sn-Ag-Cu ternary eutectic alloy during rapid solidification. These surface-modified were synthesized by an in situ chemical reduction method. The effect solidification on distribution reinforcing nanoparticles, microstructural evolution, solderability tin studied. Microstructural studies determined that refined brittle elongated intermetallic compounds (IMCs) small particles with average diameter few hundred nanometers. uniformly dispersed amorphous/recrystallized fine-grained morphology matrix. It also found addition could effectively suppress growth IMC layers, which enhanced reliability Effects solid-state ageing phenomenon tensile shear soldered joints evaluated. Higher strength ductility measured prepared from as compared unreinforced solder. A maximum enhancement ∼20% obtained.
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