Micromechanical device recoat methods

摘要: A method of fabricating a micromechanical device. Several the devices are fabricated 20 on common wafer. After fabricated, sacrificial layers removed 22 leaving open spaces where once were. These allow for movement components The optionally passivated 24, which may include application lubricant. have been passivated, they tested 26 in wafer form. testing 26, any surface treatments that not compatible with remainder processing steps 28. substrate containing completed receives conformal overcoat 30. layer is thick enough to project structures, but thin and light prevent deforming underlying structures. Once overcoated, separated 32, known good cleaned 34 remove debris left by dicing process. cleaned, be removed, however, typically place protect device during initial stages packaging Typically mounted 36 package substrate, 38 from devices, finished sealing enclose