Methods and apparatuses for forming semiconductor films
作者： Dan Guevarra , Vijay K. Kapur , Vincent Kapur , Ashish Bansal , Joel Haber
DOI:
关键词: Solvent 、 Chemical engineering 、 Boiling point 、 Semiconductor 、 Substrate (printing) 、 Analytical chemistry 、 Metal 、 Materials science 、 Ionic bonding
摘要: Described herein are systems and methods method for forming semiconductor films. In some embodiment, the comprising depositing source solution containing a solvent plurality of types metal ionic species second type on substrate heated to temperature at or above boiling point solvent. embodiments, apparatus exposing gas also provided.
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