Silicon carbide for microelectromechanical systems

作者: M. Mehregany , C.A. Zorman , S. Roy , A.J. Fleischman , N. Rajan

DOI: 10.1179/095066000101528322

关键词: Surface micromachiningMicro-Opto-Electro-Mechanical SystemsSilicon carbideFabricationNanotechnologyMicroelectromechanical systemsWide-bandgap semiconductorMaterials scienceCarbideSiliconMechanical engineeringMaterials ChemistryMechanics of MaterialsMetals and Alloys

摘要: AbstractSilicon carbide (SiC) has recently attracted attention as a wide bandgap semiconductor with great potential for microelectromechanical systems (MEMS). SiC exhibits excellent electrical, mechanical, and chemical properties, making it well suited harsh environment applications where traditional MEMS are constrained by the physical limitations of silicon (Si). This paper reviews material deposition techniques, micromachining processes, other issues regarding fabrication SiC-based sensors actuators. Special emphasis is placed on properties that make attractive MEMS, Si-based processing techniques have been adapted to realise structures devices. An introduction provided readers not familiar techniques.

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