Argon incorporation on silicon carbide thin films deposited by bias co-sputtering technique

作者: HS Medeiros , RS Pessoa , MA Fraga , LV Santos , HS Maciel

DOI: 10.1557/OPL.2012.1147

关键词: Silicon carbideComposite materialCavity magnetronDopingAnalytical chemistryThin filmArgonSputteringMaterials scienceSubstrate (electronics)Silicon

摘要: ABSTRACT The influence of negative substrate bias on the chemical, electrical and mechanical properties silicon carbide (SiC) thin films deposited onto (100) by dc magnetron co-sputtering without external heating is reported. These studies were performed using following techniques: Rutherford backscattering spectroscopy (RBS), profilometry, Raman spectroscopy, four-point probe method nanoindentation. results indicate that there a good correlation between voltage argon incorporation into SiC film, namely, under –200 V –300 have higher content elastic modulus hardness than those at 0 V. An opposite behavior was found for resistivity: has resistivity 0.45 Ω.cm whereas 7.0 Ω.cm. INTRODUCTION potential use sputtered devices applications stimulated extensive research growth conditions structural, optical, these [1-2]. Many researches been characterization produced variety varying gas flow rate, temperature, rf power, among others. Special attention given to investigation how contaminants affects [3-5]. can be intentional (i.e. when doping introduced during film growth) or unintentional elements present in deposition system are incorporated film). most widely studied contamination oxygen process. In recent years, sources control them considerably reported [6-7]. However, less effort made investigate their properties. ions (Ar

参考文章(18)
Guoju Wang, Bo Wang, Anping Huang, Mankang Zhu, Biben Wang, Hui Yan, Effects of CF4 addition on oxygen contamination of SiC films in hot filament chemical vapor deposition using CH4+SiH4+H2 Journal of Vacuum Science and Technology. ,vol. 21, pp. 1993- 1995 ,(2003) , 10.1116/1.1622674
Henrique S Medeiros, Rodrigo S Pessoa, Júlio C Sagás, Mariana A Fraga, Lúcia V Santos, Homero S Maciel, Marcos Massi, AS da Silva Sobrinho, None, SixCy Thin Films Deposited at Low Temperature by DC Dual Magnetron Sputtering: Effect of Power Supplied to Si and C Cathode Targets on Film Physicochemical Properties Materials Science Forum. pp. 197- 201 ,(2012) , 10.4028/WWW.SCIENTIFIC.NET/MSF.717-720.197
Lawrence R. Doolittle, Algorithms for the rapid simulation of Rutherford backscattering spectra Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. ,vol. 9, pp. 344- 351 ,(1985) , 10.1016/0168-583X(85)90762-1
Hiroshi Harima, Raman scattering characterization on SiC Microelectronic Engineering. ,vol. 83, pp. 126- 129 ,(2006) , 10.1016/J.MEE.2005.10.037
S. Ulrich, T. Theel, J. Schwan, H. Ehrhardt, Magnetron-sputtered superhard materials Surface & Coatings Technology. ,vol. 97, pp. 45- 59 ,(1997) , 10.1016/S0257-8972(97)00159-X
HS Medeiros, RS Pessoa, JC Sagás, MA Fraga, LV Santos, HS Maciel, M Massi, AS da Silva Sobrinho, MEH Maia da Costa, None, Effect of nitrogen content in amorphous SiCxNyOz thin films deposited by low temperature reactive magnetron co-sputtering technique Surface & Coatings Technology. ,vol. 206, pp. 1787- 1795 ,(2011) , 10.1016/J.SURFCOAT.2011.09.062
J. S. Pan, A. T. S. Wee, C. H. A. Huan, H. S. Tan, K. L. Tan, Argon incorporation and silicon carbide formation during low energy argon‐ion bombardment of Si(100) Journal of Applied Physics. ,vol. 79, pp. 2934- 2941 ,(1996) , 10.1063/1.361289
V. Kulikovsky, V. Vorlíček, P. Boháč, M. Stranyánek, R. Čtvrtlík, A. Kurdyumov, L. Jastrabik, Hardness and elastic modulus of amorphous and nanocrystalline SiC and Si films Surface & Coatings Technology. ,vol. 202, pp. 1738- 1745 ,(2008) , 10.1016/J.SURFCOAT.2007.07.029
I. Blaszczyk-Lezak, A. Walkiewicz-Pietrzykowska, T. Aoki, J. Kulpinski, A. M. Wrobel, Hard and High-Temperature-Resistant Silicon Carbonitride Coatings Based on N-Silyl-Substituted Cyclodisilazane Rings Journal of The Electrochemical Society. ,vol. 155, ,(2008) , 10.1149/1.2838067