Modeling the diffusion of solid copper into liquid solder alloys
作者： M.J. Rizvi , H. Lu , C. Bailey
DOI: 10.1016/J.TSF.2008.09.105
关键词: Scanning electron microscope 、 Diffusion process 、 Copper 、 Materials science 、 Soldering 、 Soldering process 、 Diffusion (business) 、 Metallurgy 、 Materials Chemistry 、 Electronic, Optical and Magnetic Materials 、 Surfaces, Coatings and Films 、 Surfaces and Interfaces 、 Metals and Alloys
摘要: … The modeling results reveal that the diffusion coefficient is one of the major factors that govern the rate at which solid Cu dissolve in the molten solder. The predicted dissolved amounts …
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