Rate of consumption of Cu in soldering accompanied by ripening

摘要: What is the rate of consumption Cu in soldering reactions has been a critical question electronic packaging technology. The films are consumed by Cu–Sn compound formation. Because thickness limited and rework solder joint requires layer unreacted Cu, loss must be under control. At interface, intermetallic compounds do not form layered structures. Rather, Cu6Sn5 phase grows as scalloplike grains into molten ripening occurs between grains. Therefore, it difficult to determine growth rate, turn rate. Using cross‐sectional top‐polished samples, we have measured total volume formed eutectic SnPb alloy substrate function reflow time temperature. We deduced that after 1 min reflow, for example, was about 0.36, 0.47, 0.69 μm at 200, 220, 240 °C, respectively.