Metallurgical reaction and mechanical strength of electroless Ni-P solder joints for advanced packaging applications
作者： K. C. Hung , Y. C. Chan , C. W. Tang
关键词: Mechanical strength 、 Crystallization 、 Soldering 、 Metallurgy 、 Diffusion 、 Reflow time 、 Materials science 、 Fracture (geology) 、 Intermetallic
摘要: We have studied the metallurgical reaction and mechanical strength of electroless Ni-P solder joints as a function reflow time at 220 °C. It is found that both Ni3Sn4 intermetallics Ni3P are formed due to reaction-assisted crystallization. However, after first 15 min reflow, an unusual depression growth has been observed. A detailed description diffusion mechanism presented explain prohibition growth. may mutual effect on each other during since there direct correlation between ending The characteristic demonstrated. interfacial discussed. Also, it different times will result in fracture interfaces sheared joints. explanation surface morphology explored.
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