Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints
作者： K.S. Kim , Katsuaki Suganuma , Toshitada Shimozaki , C.G. Lee
DOI: 10.4028/WWW.SCIENTIFIC.NET/MSF.439.7
关键词:
摘要: The effects of the fourth elements, i.e., Ni and Co, on microstructural features Sn-3wt%Ag-0.5wt%Cu lead-free solder Cu joints were investigated. interfacial phases Sn-3Ag-0.5Cu/Cu are typical 6 Sn 5 scallops. Sn-3Ag-0.5Cu (-0.1 wt%X; X = Co)/Cu form very fine Sn-Cu-Ni Sn-Cu-Co scallops at interface. growth kinetics total ternary compound layers was examined. apparent activation energies 64 112 kJ/mol, respectively.
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